s h m 1 0 9 h h a - 1 r 0 m f (a) (b) (d) (c) 1. part no. expression : (b) dimension code (c) inductance code : 1r0 = 1.00uh (a) series code 2. configuration & dimensions : a 4. materials : superworld electronics (s) pte ltd (a) core : sf3 alloy powder (c) solder : sn99.95%-cu0.05% 3. schematic : (d) tolerance code : m = 20% (e) f : rohs compliant shm109hha series dip power choke coil pg. 1 10.06.2011 pcb pattern 10.5 max. 10.0 max. 3.4 0.5 bcd 10.5 max. (b) wire : enamelled copper wire unit:m/ m e 5.3 0.5 a b ?w c d f ?w 1.4 0.1 10.0 max. 10.5 max. 10.5 max. 3.4 0.5 5.3 0.5 1.4 0.1 7.5 0.5 7.5 0.5 l series shm109hha-r32mf shm109hha-r50mf (e) 11.0 11.0 f 10.5 max. 10.5 max. SHM109HHA-R80MF shm109hha-1r0mf 7.5 0.5 1.3 0.1 5.3 0.5 10.5 max. 3.4 0.5 10.0 max. 10.0 max. 10.5 max. 3.4 0.5 1.2 0.1 5.3 0.5 7.5 0.5 e l g h e 5.3 0.5 5.3 0.5 5.3 0.5 5.3 0.5 f 0.5 0.2 0.5 0.2 0.5 0.2 0.5 0.2 g l 1.7 typ. 1.6 typ. 1.5 typ. 1.7 typ. h r32a yy.ww note : specifications subject to change without notice. please check our website for latest information. 10.0 max. 10.5 max. 10.5 max. 3.4 0.5 5.3 0.5 1.3 0.1 7.5 0.5 shm109hha-r68mf 5.3 0.5 0.5 0.2 1.6 typ.
superworld electronics (s) pte ltd note : specifications subject to change without notice. please check our website for latest information. pg. 2 10.06.2011 20% @ 0adc inductance l ( uh ) 0.50 0.32 6. electrical characteristics : shm109hha-r32mf shm109hha-r50mf part no. 38 35 0 irms max. ( a ) 0.35 42 42 0.52 dcr isat max. ( a ) ( m
) 10% 7. characteristics curves : f) part temperature (ambient + temp. rise) : should not exceed 125 c under worst case operating conditions. e) isat (a) : will cause l to drop approximately 30% d) irms (a) : will cause an approximately temp. rise ? t < 40c a) test frequency : 100khz/1.0v b) operating temp. : -25 c to +125 c c) ambient temp. : 20 c 5. general specification : 0 45 45 min. q dip power choke coil shm109hha series 0.80 1.00 shm109hha-1r0mf SHM109HHA-R80MF 60 0.92 25 30 32 32 0.80 45 0.68 shm109hha-r68mf 33 33 0.62 45 010.52131.542 dc current(a) 0 0.1 0.2 0.3 0.4 0.5 indu c tan c e (uh) 0 10 20 30 40 50 60 70 80 te mp. ri se ( o c) hmpi109hha-r32m shm109hha-r32mf 010.52131.542 dc current(a) 0 0.25 0.5 0.75 1 in d u c t an c e ( uh ) 0 10 20 30 40 50 60 70 80 temp. ri se( o c) hmpi109hha-r50m shm109hha-r50mf
note : specifications subject to change without notice. please check our website for latest information. superworld electronics (s) pte ltd pg. 3 10.06.2011 7. characteristics curves : dip power choke coil shm109hha series 0 8.25 16.5 24.75 33 dc current (a) 0 0.3 0.6 0.9 1.2 indu c tan c e (uh) 0 10 20 30 40 50 60 70 80 temp. ri se( o c) hmpi109hha-r68m shm109hha-r68mf 0 8.5 17 25.5 34 dc current(a) 0 0.4 0.8 1.2 1.6 indu c t a n c e (uh) 0 10 20 30 40 50 60 70 80 temp. ri se( o c) hmpi109hha-r80m SHM109HHA-R80MF 0 6 12 18 24 30 dc current(a) 0 0.5 1 1.5 2 indu c t a n c e (uh) 0 10 20 30 40 50 60 70 80 temp. ri se( o c) hmpi109hha-1r0m shm109hha-1r0mf
superworld electronics (s) pte ltd note : specifications subject to change without notice. please check our website for latest information. pg. 4 10.06.2011 performance refer to standard electrical characteristics list should be covered with solder. more than 90% of the terminal electrode preheating 60 seconds 1. appearance : no significant abnormality 2. inductance change : within 10% of initial value preheating 60 seconds no disconnection or short circuit. 2. inductance : within 10% of initial value. 1. appearance : no damage no disconnection or short circuit. 2. inductance : within 10% of initial value. 1. appearance : no damage reliability test humidity resistance high temperature life test life test low temperature thermal shock solder heat resistance 150 c 260 c 150 c 245 c inductance electrical characteristics test dcr heat rated current (irms) solderability test mechanical performance test saturation current (isat) 8. reliability and test condition : item time : 500 12 hours applied current : rated current humidity : 90% to 95% temperature : 40 5 c temperature : 85 5 c time : 500 12 hours temperature ( c) conditions of 1 cycle. temperature : -20 5 c time : 500 12 hours room temperature room temperature 125 3 -25 3 recovery: 4 to 24hrs of recovery under the standard 2 total : 5 cycles 4 3 step 1 within 3 within 3 30 3 times (min.) 30 3 preheat : 150 c, 60sec. solder : lead free solder temperature : 260 5 c flux : rosin dip time : 10 0.5sec. 10 0.5 seconds dipping cooling natural 4 1 seconds dipping cooling natural hp4284a or ch3302/13 20/1320s test condition isat(a) will cause lo to drop approximately 30% hioki3540 irms(a) will cause an temp rise < 40 c typ. solder bath at 245 5 c for 5 seconds after fluxing, component shall be dipped in a melted condition after the removal from test chamber condition after the removal from test chamber recovery: 4 to 24hrs of recovery under the standard condition after the removal from test chamber recovery: 4 to 24hrs of recovery under the standard condition after the removal from test chamber recovery: 4 to 24hrs of recovery under the standard dip power choke coil shm109hha series appearance : cracking, chipping and any other random vibration test a period of 2 hours in each of 3 mutually perpendicular directions and times : x, y, z directions for 2 hours. amplitude : 1.52mm frequency : 10-55-10hz for 1 min. directions (total 6 hours). defects harmful to the characteristics should not be allowed.
superworld electronics (s) pte ltd note : specifications subject to change without notice. please check our website for latest information. pg. 5 10.06.2011 b) 280 c tip temperature (max) temperature c e) use a 20 watt soldering iron with tip diameter of 1.0mm temperature c figure 1. re-flow soldering f) limit soldering time to 3 secs. d) 1.0mm tip diameter (max) 20~40s max. preheating 60~180s c) never contact the ceramic with the iron tip 150 natural soldering cooling over 1min. figure 2. iron soldering within 3secs. gradual cooling natural preheating soldering 150 350 300 cooling wave and re-flow soldering systems. if hand soldering cannot be avoided, the preferred technique is the utilization of hot by the difference in coefficients of expansion between solder, chip and substrate. our terminations are suitable for all mildly activated rosin fluxes are preferred. the minimu m amount of solder can lead to damage from the stresses caused recommended temperature profiles for re-flow soldering in figure 1. products attachment with soldering iron is discouraged due to the inherent process control limitations. in the event that a soldering iron must be employed the following precautions are recommended. 9-2.1 solder re-flow : air soldering tools. a) preheat circuit and products to 150 c. 9-2.2 soldering iron (figure 2) : note : 9-1. recommended pc board pattern 9. soldering and mounting : 9-2. soldering dip power choke coil shm109hha series 11.0 11.0 f h e l e 5.3 0.5 5.3 0.5 7.5 0.5 7.5 0.5 l series shm109hha-r32mf shm109hha-r50mf SHM109HHA-R80MF shm109hha-1r0mf 7.5 0.5 5.3 0.5 5.3 0.5 7.5 0.5 5.3 0.5 5.3 0.5 5.3 0.5 5.3 0.5 f 1.7 typ. 1.6 typ. 1.5 typ. 1.7 typ. h unit:m/m 200 217 tp(260 c/10s max.) 480s max. 60~150s time(sec.) 5.3 0.5 7.5 0.5 shm109hha-r68mf 5.3 0.5 1.6 typ. 25
superworld electronics (s) pte ltd note : specifications subject to change without notice. please check our website for latest information. pg. 6 10.06.2011 10. packing and quantity : inner box carton 840 1680 styrofoam size 120 shm109hha a) products should be handled with care to avoid damage or contamination from perspiration and skin oils. application notice 2. transportation : c) bulk handling should ensure that abrasion and mechanical shock are minimized. b) the use of tweezers or vacuum pick up is strongly recommended for individual components. c) the packaging material should be kept where no chlorine or sulfur exists in the air. b) recommended products should be used within 6 months from the time of delivery. a) temperature and humidity conditions : less than 30 c and 70% rh. to maintain the solderabililty of terminal electrodes : 1. storage conditions : dip power choke coil shm109hha series
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